Ion sputtering

Ion beam assisted deposition ( IBAD) is a materials engineering technique which combines ion implantation with simultaneous sputtering or another physical vapor deposition technique. Besides providing independent control of parameters such as ion energy , temperature and arrival rate of atomic species during deposition, this technique is especially useful to create a gradual transition between the substrate material and the deposited film, and for depositing films with less built-in strain than is possible by other techniques. Using this technique, we are able to sputter followings materials (up to 6 multilayer): Al, Au, Co, Cu, Hf, Nb, NiCr, Ta, Ti and W .